Cold Bump Pull

Cold Bump Pull

Cold Bump Pull

LD Microprecision achieved technical breakthrough in the field of complex ultrafine processes manufacturing know-how to produce the tweezer pull with tight tolerance and uncompromising performance results. Application for both solder bump and Wire Bond ball bond vertical pull.

Category:
Size Table
Part NumberModalBall Diameter (μm)Ball Pitch (μm)
CBP-11-300-500-01DAGE300500
CBP-11-450-650-01DAGE450650
CBP-11-450-800-01DAGE450800

* For sizes not found above, we can custom made to meet customer requirements.

Cold Bump Pull Zoom

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