Welcome to LD Microprecision

Your Global Source For Semiconductor / LED Packaging Solutions

Die Bonding

Design, manufacture and market full range of die bonding tools.
Customized design available.

Wire Bonding

High performance EFOs applicable for K&S, ASM, ESEC, Shinkawa, Kaijo and others.
Available for both gold and copper wire.

Bondtest

For total process control and product reliability assurance.
Applicable to DAGE, XYZ Tech, Royce, Rhesca and others.

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Our Company

LD Microprecision design and manufacture high quality precision tools for the semiconductor / electronic industry. By applying refined manufacturing process, advanced material utilisation and engineering capabilities, we are able to to provide solutions and innovative services that can meet and satisfy our customers expectations.

Our tight tolerance quality control ensures high performance parts. We will continue to expand our products range over times by introducing complementary equipment/tools to meet the needs of the industry.

Would you like to know more? Then get in touch now!

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